Search found 2 matches

by protocutter42
Fri Sep 27, 2019 5:28 pm
Forum: ProtoMAX Operations
Topic: Cutting resolution for fine detail
Replies: 3
Views: 2386

Re: Cutting resolution for fine detail

I see. Thanks for quick reply. The specific applications vary a bit but a typical application may use a standard silicon wafers (0.5 mm) or glass coverslips (0.2 mm) as a platform material for device fabrication (microfluidics, detector arrays, etc). In some cases, all that is needed are pass-throug...
by protocutter42
Fri Sep 27, 2019 1:56 pm
Forum: ProtoMAX Operations
Topic: Cutting resolution for fine detail
Replies: 3
Views: 2386

Cutting resolution for fine detail

Anyone with experience cutting very detailed structures? The abrasive waterjet nozzle has a 0.2032 mm orifice assembly. Are there any specs about the smallest diameter hole that can be bored through a sheet of material (or alternatively, what is the most narrow line width that can be cut)? Are there...